Electrochemical Behavior as an Indicator of Functional Performance Control in Bulk Metallic Glasses

Keywords

Ti-based metallic glasses, biocompatibility, pitting corrosion, nanoporous oxide layers

Abstract

Ti-Cu-(Pd) bulk metallic glasses (BMGs) offer high strength-to-stiffness ratios, but their biocompatibility is compromised by their high copper content, which affects cytocompatibility and corrosion resistance. Two BMGs, Ti₄₇Zr_7.5Cu₃₈Fe_2.5Sn₂Si₁Ag₂ and Ti₄₀Zr₁₀Cu₃₄Pd₁₄Sn₂, were studied in a phosphate buffer solution (PBS, pH 7.4, 37 °C) in free corrosion and anodic polarisation conditions. The first alloy exhibited poor passive film stability and pit repassivation ability, whereas the second alloy demonstrated higher pitting resistance with corrosion products enriched in Cu, Zr, and Pd. To improve biocompatibility, both alloys underwent a pseudo-dealloying process to create nanoporous Ti/Zr oxide layers. This treatment suppressed chloride-induced pitting, achieving corrosion resistance comparable to that of cp-Ti and rendering the alloy promising for use in implants.

References

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